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BL-R7601MU2 Product Specification IEEE 802.11b/g/n (1T1R) WLAN USB Module Version: 3.1 Customer Date Model Name BL-R7601MU2 Part NO. Blink Approve Field ENGINEER QC SALES Customer Approve Field ENGINEER QC MANUFACTORY PURCHASING Content Content 1 1. General Description 2 2. The range of applying 2 3. Product Specification 2 3.1 Function Block diagram 2 3.2 Electrical and Performance Specification 3 3.3 DC Characteristic 3 3.4 RF Characteristic 4 3.4 Product Photo 5 3.5 Mechanical Specification 5 3.6 Product Pin Definition 6 4. Supported platform 6 5. WiFi RF Circuit reference pictures 6 6. Package Information 7 7. Typical Solder ReflowProfile 7 8. Precautions for use 7 1. General Description BL-R7601MU2 product accord with FCC CE is a highly integrated Wi-Fi single chip which support 150 Mbps PHY rate. It fully complies with IEEE802.11n and IEEE802.11b/g standard, offering feature-rich wireless connectivity at high standard, and delivering reliable, cost-effective throughput from an extended distance.Optimized RF architecture and baseband algorithms provide superb performance and lower power consumption. Intelligent MAC design deploys a high efficient DMA engine and hardware data processing accelerators which offloads the host processor. 2. The range of applying MID, networking camera, STB GPS, E-book, Hard disk player, Network Radios, PSP and other device which need be supported by wireless networking. 3. Product Specification 3.1 Function Block diagram 3.2 Electrical and Performance Specification Item Description Product Name BL-R7601MU2 Major Chipset MT7601 Host Interface USB2.0 Standard IEEE 802.11b, IEEE 802.11g,IEEE 802.11n Frequency Range 2.4GHz~2.4835GHz Modulation Type 802.11b: CCK, DQPSK, DBPSK 802.11g: 64-QAM,16-QAM, QPSK, BPSK 802.11n: 64-QAM,16-QAM, QPSK, BPSK Working Mode Infrastructure, Ad-Hoc Data Transfer Rate 802.11b: 11, 5.5, 2, 1 Mbps 802.11g: 54, 48, 36, 24, 18, 12, 9, 6 Mbps 802.11n: 150Mbps(MAX) Spread Spectrum IEEE 802.11b: DSSS (Direct Sequence Spread Spectrum) IEEE 802.11g/n:OFDM (Orthogonal Frequency Division Multiplexing) Sensitivity @PER 135M:-68dBm@10%PER 54M:-74dBm@10%PER 11M:-86dBm@8%PER 6M: -90dBm@10%PER 1M: -92dBm@8%PER RF Power(Typical) 135M:14dBm, 54M:15dBm, 11M:17dBm Antenna type Connect to the external antenna through the half hole The transmit distance Indoor 100M, Outdoor 300M, according -the local environment Dimension(L*W*H) 13.0*12.3*1.5mm (LxWxH) ,Tolerance: +-0.15mm Power supply 3.3V +/-0.15V Power Consumption standby mode , TX mode Clock source 40MHz Working Temperature 0°C to +50°C Storage temperature -40°C to +85°C 3.3 DC Characteristic Terms Contents Specification : IEEE802.11b Mode DSSS / CCK Frequency 2412 – 2484MHz Data rate 1, 2, 5.5,11Mbps DC Characteristics min Typ. max. unit TX mode 239 245 249 mA Rxmode 91 92 93 mA Sleepmode 47 48 48 mA Specification : IEEE802.11g Mode OFDM Frequency 2412- 2484MHz Data rate 6, 9, 12, 18, 24, 36, 48, 54Mbps DC Characteristics min Typ. max. unit TX mode 149 150 153 mA Rxmode 92 93 100 mA Sleepmode 46 48 49 mA Specification : IEEE802.11n Mode OFDM Frequency 2412- 2484MHz Data rate 6.5,13, 19.5,26, 39, 52, 58.5, 65Mbps DC Characteristics min Typ. max. unit TX mode 151 152 153 mA Rxmode 91 92 93 mA Sleepmode 47 48 49 mA 3.4 RF Characteristic Mode Rate(Mbps) Power(dBm) EVM(dB) Sensitivity(dBm) CH1 CH7 CH13 CH1 CH7 CH13 CH1 CH7 CH13 11b 1 17.43 17.79 17.48 -31.18 -32.78 -31.52 -95 -95 -95 11 17.50 17.26 17.91 -32.87 -3* -33.41 -89 -89 -89 11g 6 17.58 17.28 17.49 -34.21 -33.18 -33.87 -90 -90 -90 54 16.70 16.57 16.33 -30.42 -31.25 -31.02 -74 -74 -74 11n HT20 MCS0 17.32 17.24 17.48 -28.97 -29.18 -29.65 -88 -88 -88 MCS7 16.86 16.40 16.12 -30.67 -30.98 -31.70 -70 -70 -70 11n HT40 MCS0 17.54 17.84 17.26 -30.54 -30.21 -30.47 -89 -89 -89 MCS7 16.38 16.06 16.12 -31.41 -31.28 -31.07 -69 -69 -69 3.4 Product Photo TOP Bottom 3.5 Mechanical Specification 13.0mm*12.3mm*1.5mmTolerance: +-0.15mm 3.6 Product Pin Definition 4. Supported platform Operating System CPU Framework Driver WIN2000/XP/VISTA/WIN7 X86 Platform Enable LINUX2.4/2.6 ARM, MIPSII Enable WINCE5.0/6.0 ARM ,MIPSII Enable 5. WiFi RF Circuit reference pictures Note: 1.Pls reserve a “pi” circuit for antenna matching. 2. The RF circuit needs to keep 50 Ω impedance. 3. The USB differential pair needs to keep 90 Ω impedance. 6.Package Information 7. Typical Solder ReflowProfile 8. Precautions for use 1. Pls handle the module under ESD protection. 2. Reflow soldering shall be done according to the solder reflow profile. Peak temperature 245℃. 3. Products require baking before mounting if humidity indicator cards reads >30% temp <30 degree C, humidity < 70% RH, over 96 hours. Baking condition: 125 degree C, 12 hours Baking times: 1 time 4. Storage Condition: Moisture barrier bag must be stored under 30 degree C, humidity under 85% RH. The calculated shelf life for the dry packed product shall be a 12 months from the bag seal date. Humidity indicator cards must be blue, <30%.